Engineering Service
Assembly Service
Testing Service
 
Wafer Level Service
Back Grinding
wafer grinding machine
Purpose
  • Thin wafer by grind wafer backside
Capability
  • Min. 50um wafer thickness
  • Variation: +/-1.5um(8”),+/-3um(12”)
  • Bumped silicon wafer
  • Fully auto mounting and de-mounting during grinding process
  • 8000 pcs/month
Wafer Sawing
wafer sawing machine
Purpose
  • Divide whole wafer into dice for DM
Capability
  • Wafer
    --CMOS, SiGe wafers
    --4~12” maximum
  • Water Saw Water
    --DI, 0.6-1.0M ohm
  • Dual Spindle
  • Equipped with loading and unloader

Address:No.9 Jianye East Road, Torch Hi-tech Development Zone, Zhongshan, Guangdong Province,China. TEL:+86-760-23381357 FAX:+86-760-23382117
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