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．PassiveOptical Components
->MEMS module & Sensor
 
System in Package Module(SiP)
1. About SiP IPHONE CHIP
  • Few chips in one package
  • Passive components in or on substrates
2.SiP's advantage
  • Cost, speed, size and product performance
  • Easy to integrate
  • Quick to market
  • Good electrical performance
  • Substrate cost is cheap
3.Application of SiP SIP_APPLICATION
  • RF Power amplifier
  • RF Front End Module
  • Antenna Switch Module
  • Transceiver
  • Smart SIM Card
  • Multi Chip Package
  • MEMS sensor
  • Ambient Light Sensor
  • Bluetooth Module
  • Wireless Module
  • GPS Module
  • TOF Module
  • DC-DC Converter
4.Major Product Description  
2G3G4G 2G/2.5G/3G/4G Front End Module
GSM Multi Mode Multi Band Power Amplifier Module
WIFI WiFi Front End Module
WCDMA 2G/2.5G/3G/4G PA Module
Mobile WiFi Mobile WiFi Module
Antenna Switch Antenna Switch Module
Address:No.9 Jianye East Road, Torch Hi-tech Development Zone, Zhongshan, Guangdong Province,China. TEL:+86-760-23381357 FAX:+86-760-23382117
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