Reliability and Failure Analysis
Reliability Test service
Type |
Test item |
Standard |
Condition |
IC packaging |
Moisture Sensitivity/Precondition |
J-STD-020,JESD22-A113 |
TC -40℃ to +60℃ 5 cycles , baking 125℃/24H ,Moisture soaking, TH 30°C/60%RH/192hrs,IR reflow 3 cycles |
Thermal Shock |
JESD22-A106 |
-65 ℃– 150℃ |
Pressure Cooker/Autoclave |
JESD22-A102 |
121℃ ,2atm,100%RH,168H |
HAST Biased/Unbiased |
JESD22-A110,A118 |
130℃,85% RH,96hrs ,without bias |
High Temperature Storage Life |
JESD22-A103 |
85℃, 1000 hrs |
Thick Film |
Thermal Shock |
JESD22-A106 |
0 ℃-100 ℃ 500 cy |
High Temperature Storage Life |
JESD22-A103 |
85℃ 500hrs
|
Optical module |
Temperature Cycling |
J-ESD22-A104/MIL-STD-883 Method 1010.7 |
-40℃–85℃ 500cy |
Temperature and Humidity Biased / Unbiased |
JESD22-A101/EIAJ-IC-121 |
85 ℃ 85% RH 1000 hrs |
High Temperature Storage Life |
MIL-STD-883 Method 1008 |
58℃ 2000hrs with bias
85℃ 2000hrs without bias
|
Optical Sensor |
Moisture Sensitivity/Precondition |
J-STD-020,JESD22-A113 |
TC -40℃ to +60℃ 5 cycles , baking 125℃/24H ,Moisture soaking, TH 30°C/60%RH/192hrs,IR reflow 3 cycles |
HAST Biased/Unbiased |
JESD22-A110,JESD22-A118 |
130℃,85% RH,96hrs ,without bias |
High-temperature storage life |
JESD22-A103 |
85℃, 1000 hrs |
Unbiased Temperature/Humidity |
JESD22-A101 |
85 °C / 85% RH, 500hrs |
Temperature Cycling |
JESD22-A104 |
-40℃/+85℃, 1000 cycles |
Failure Analysis Service
Equipment |
Capability |
SAM(Scanning Acoustic Microscopes) |
High resolution,non-destructive detection of delamination,void,crack |
SEM(Scanning Electron Microscopes) |
Up to x150,000 Magnification Inspection |
EDS(Energy Dispersive Spectrum) |
Surface Composition Analysis / depth>3um,detective limit ≧ 0.5% |
Chemical Auto-Decapsulator |
Encapsulation removal by Chemical etching |
Grinder/Polisher |
Package Cross-sectioning or Delayering |
Optical Microscopes |
Up to 1000X Magnification Optical Inspection |
X-Ray/CT |
Real time Microfocus X-ray/500nm resolution |
Spiral Viscometer |
Measurement Range : 5.0pa·s~800pa·s |
Solder Paste Analyzer System |
Content test:
Solder paste tack ability measurement.
Slumping ability test.
Solder ball residue test.
|
Laser De-cap |
8micron resolution de-cap |
Ion Chromatography |
electrical conductance definition : 0.0047 Ns /cm |
FTIR |
Optical spectrum:7600-450cm-1(DTGS detector),7600-650cm-1(MCT-A detector);spatial resolution:10μm |
I-V Curve trace |
Accurate measurement ranges of 0.1 fA - 1 A and 0.5 μV - 200 V |