Engineering Service
Assembly Service
Testing Service
Packaging Capability--Backend
  • Molding Capability
    • Product types: LGA,QFN,LTCC,Double Mold,Ceramic
    • Vacuum mold type: top/bottom chase vacuum mold
    • Elastic mold: to prevent thin IC package crack, delamination and applicable to embedded component substrate package
    • Mold capability: Minimum PCB thickness is 125um, Maximum package size 250*74mm, and Minimum Gap between component and mold chase is 100um
    • Molding capability: transfer molding and compression molding
  • Laser Mark Capability
    • Different laser sources for mold compound, plastic and metal etc
    • Auto scanning for marking digits to detect marking error
    • Support small package products 2D scanning and mark mapping
    • Laser via opening to connect different layers
  • Sawing Capability
    • According to customers’ product size and ESD requirement, we can choose saw tape or assorted vacuum table saw.
    • Auto pick & place machine to prevent manual operation error
    • According to different materials(PCB, QFN, Ceramics, Glass etc), we can offer assorted blade and optimized sawing solutions
  • Sputtering Capability
    • To meet customer products’ requirement, we can provide optimized sputtering materials and process control
    • X-ray sputtering height monitoring
    • Cover pre/post sputtering process automation, such as auto attach/pick and AOI
  • Coating capability
    • Color toning capable
    • Plasma clean->Coating->Curing automatically
    • High accuracy of layer thickness: +/-1um
  • Auto Optical Inspection Capability
    • Single product 3D inspection including top side, bottom side and vertical side
    • 100% AOI inspection to cover all visual defects including product damage, void, component exposure, scratch, unbalance height and so on.

Address:No.9 Jianye East Road, Torch Hi-tech Development Zone, Zhongshan, Guangdong Province,China. TEL:+86-760-23381357 FAX:+86-760-23382117
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