Packaging Capability--Backend
- Molding Capability
- Product types: LGA，QFN，LTCC，Double Mold，Ceramic
- Vacuum mold type: top/bottom chase vacuum mold
- Elastic mold: to prevent thin IC package crack, delamination and applicable to embedded component substrate package
- Mold capability: Minimum PCB thickness is 125um, Maximum package size 250*74mm, and Minimum Gap between component and mold chase is 100um
- Molding capability： transfer molding and compression molding
- Laser Mark Capability
- Different laser sources for mold compound, plastic and metal etc
- Auto scanning for marking digits to detect marking error
- Support small package products 2D scanning and mark mapping
- Laser via opening to connect different layers
- Sawing Capability
- According to customers’ product size and ESD requirement, we can choose saw tape or assorted vacuum table saw.
- Auto pick & place machine to prevent manual operation error
- According to different materials(PCB, QFN, Ceramics, Glass etc), we can offer assorted blade and optimized sawing solutions
- Sputtering Capability
- To meet customer products’ requirement, we can provide optimized sputtering materials and process control
- X-ray sputtering height monitoring
- Cover pre/post sputtering process automation, such as auto attach/pick and AOI
- Coating capability
- Color toning capable
- Plasma clean->Coating->Curing automatically
- High accuracy of layer thickness: +/-1um
- Auto Optical Inspection Capability
- Single product 3D inspection including top side, bottom side and vertical side
- 100% AOI inspection to cover all visual defects including product damage, void, component exposure, scratch, unbalance height and so on.