Engineering Service
Assembly Service
Testing Service
 
D/W
Die Mounting
DM MACHINE
Purpose
  • Die Mounting
Capability
  • Multi dice capability
  • 50um thickness capability
  • 0.6 sec per chip
  • Up to 12 ”wafer with flip function
  • Up to 4 layers stack die capability
DM MACHINE

AOI After Die Mounting
Purpose
  • Automatic inspection Die mounting
DM AOI
Capability
  • Auto loader and unloader
  • 2D barcode reading & E-map
  • Optical resolution:7.8um
  • Inspection function: Missing die , die rotate , epoxy on die, etc.
Wire Bonding
DM MACHINE
Purpose
  • Wire Bonding
Capability
  • Ultra fine pitch: 35um @3 sigma
  • Bond placement accuracy: +/-2um
  • 17 wires per second
  • Gold Wire:Min:0.6mil
  • Copper Wire:Min:0.8mil
DM MACHINE

AOI After Wire Bonding
Purpose
  • Automatic inspection Wire boding
WB AOI
Capability
  • Auto loader and unloader
  • 2D barcode reading & E-map
  • Optical resolution:10um
  • Inspection function: Missing wire , wire left , wire sweep, etc.
Address:No.9 Jianye East Road, Torch Hi-tech Development Zone, Zhongshan, Guangdong Province,China. TEL:+86-760-23381357 FAX:+86-760-23382117
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