Test Service
SST Test solutions
Light Sensor/ToF/LiDAR
· Dominant Light Sensor Test Provider in China: Holding over 80% market share.
· Global Innovation: Launched the world’s first 18-site simultaneous ALS test solution, delivering significant cost savings.
· Rapid Turnkey Deployment: Provides complete CP (Chip Probing) & FT (Final Test) solutions with a guaranteed 4-week lead time.
RF/Wireless Communication
· Full RF Test Expertise: PA, ASM, Switches, Filters, LNA, WiFi & more.
· High-Efficiency Multi-Site Testing: 4x parallel site capacity.
· Proprietary Cost-Optimized Tester.
· 4-Week Turnkey CP/FT Deployment.
· Real-Time Yield & CTQ Analytics.
MEMS
· Proprietary Tester Development: Cost-optimized in-house ATE solution.
· High-Density MEMS Handler: 256-site capacity (In Development).
· Integrated Motion Testing: 6/9-Axis Combo Test Solution.
MCU/AP
· Proprietary ATE Platform: Cost-optimized
self-developed tester.
· High-Density Testing: 32-site simultaneous
capability.
· Smart Monitoring GUI: Real-time yield &
CTQ analytics
Chip Probing Service
SSTtester (PXle)
Qty: 19
Chroma 3380P
Qty: 5
SEMIC OPUS3
Qty: 20
Prober UF200A
Qty: 4
Configuration:
Up to 256 digital pins at 200MHz
Broad range of DC Test:
Source/measure currents from 1pA to 3A
Source/measure voltages from 1uV to 60V
Wafer Specifications
Sizes:6，8, 12 inches
Thickness: 150-1000um
Die Size:0.25~100mm
Final Test Service
Optical test
·ALS, ToF, PS,RGB sensor
·Max test sites: 18 sites
·Input: Bowl in/JEDEC tray
·Output: Tape & Reel/ JEDEC tray
·Unit size: 1x1~7x7mm
·6S AOI inspection
LiDAR test
·Automotive LiDAR
·Max test sites: 8 sites
·Tri-Temp test
·Unit size: 2x2~65x65mm
·Tray in/Tray out
MEMS test
·G sensor, accelerometer, Gyroscope, Magnetic sensor, Pressure sensor
·Max test sites: 36 sites
·Input: Bowl in/JEDEC tray
·Output: Tape & Reel/ JEDEC tray
·Unit size: 1x1~7x7mm
RF test
·RFPA, Filter, GPS, Bluetooth, WiFi, WiMax, PMIC
·Max test sites: 4 sites
·Input: Bowl in/JEDEC tray/Sputter jig
·Unit size: 0.3x0.6~10x10mm
·6S AOI inspection